
Pour les ingénieurs concepteurs du secteur spatial, la sélection des composants est une tâche cruciale. La fiabilité de chaque pièce, y compris les composants passifs comme les inductances, est primordiale pour le succès des satellites, des lanceurs et des sondes spatiales. La qualification et la sélection de ces composants sont régies par des normes rigoureuses, principalement les normes de la Coordination européenne des composants spatiaux (ESCC) et les normes militaires américaines (MIL-STD).
Cette note technique propose une comparaison objective des cadres de qualification des inductances spatiales, en particulier la norme ESCC 3201 (et ses spécifications détaillées) et la norme MIL-STD-981. Comprendre les différences subtiles dans leurs méthodes de test et leurs exigences spécifiques est essentiel pour garantir la conformité aux programmes et des performances optimales des composants.
Equivalent
tests include:
ü
Visual Inspection (Precap): Visual inspection before encapsulation.
ü
Dimension Check: Verification of physical dimensions
against specifications.
ü
External
Visual Inspection:
Post-encapsulation inspection.
ü
Temperature Rise: Both standards employ the same testing
method.
ü
Resistance to Soldering Heat: Tested per MIL-STD-202 Method 210.
ü
Solderability: Tested per MIL-STD-202 Method 208.
ü
Terminal Strength: Tested per MIL-STD-202 Method 211.
Burn-In and Operating Life
ü
Burn-In: ESCC qualification specifies a significantly longer
burn-in period of 168 hours. MIL-STD-981 requires 96
hours.
ü
Operating Life: Both standards mandate a 2000-hour life
test, typically per MIL-STD-202 Method 108. The MIL standard specifies this
as a cycled test (90 minutes ON, 30 minutes OFF).
Mechanical and Environmental
Stress
ü
Vibration (SESI/CMC): For low-profile inductors and chokes
(Families 4 & 37), the ESCC qualification is more stringent, testing at 30g. The comparable MIL requirement
is 20g.
ü
Mechanical Shock: For the SESI/CMC series, a 100g shock
test (per MIL-STD-202 Method 213) is part of the standard ESCC flow. For the MPCI (chip inductor)
series, this test is not applicable under the ESCC 3201/008 specification.
ü
Thermal Shock: Both standards utilize MIL-STD-202 Method
207, applying 25 cycles between -55°C and +125°C.
ü
Permanence of Marking: ESCC specifies testing according to ESCC
24800, while
MIL-STD-981 uses MIL-STD-202 Method 215.
ESCC 3201 includes several environmental tests that are not part of the standard MIL-STD-981 qualification flow.
ü
Barometric Pressure (Dielectric at Low Pressure): MIL-STD-202 Method 105. This test verifies dielectric strength at a simulated
high altitude (e.g., 4.4 kPa), which is critical for launch
applications.
ü
Moisture Resistance: A 10-cycle test per MIL-STD-202 Method
106. This assesses component
reliability in high-humidity environments.
ü
Overload: The MIL standard requires an overload test of 1.5x
rated current for 5 minutes. The comparable ESCC test is
significantly longer, requiring 30 minutes at 1.5x rated current.
ü
Weight: This is a guaranteed parameter under ESCC but not a
formal test item.
Conversely, the MIL-STD-981 flow includes tests not explicitly mirrored in the ESCC groups.
ü
Dielectric Low Voltage: The ESCC qualification includes a
dielectric test performed at 500V.

For programs requiring
adherence to MIL-STD-981, many tests not included in the standard ESCC flow can
be performed upon request. This allows for component procurement that meets
specific contractual or mission-assurance requirements without necessitating a
full, separate qualification.
The following MIL-STD tests
are commonly available as optional screenings or as part of a lot acceptance
flow:
ü
Radiography (X-Ray): Can be performed upon request.
ü
Destructive Physical Analysis (DPA): Can be performed upon request.
ü
Mechanical Shocks & Vibrations: For the MPCI series, these tests can be
added to align with MIL requirements.
ü
Partial Discharge: This test can be performed upon request.
ü
Induced Voltage: Can be subcontracted if required.


At Exxelia Micropen, we integrate material science + design engineering + printed electronics and the result is Exxelia Micropen technology. This proprietary technology is utilized to design and manufacture the most precise and stable designs in the industry.